We have CNC machines and cooperate with universities and research institutions and have rubber material research and development team.
We established long-term cooperative relations of technology talents with Qingdao University of Science & Technology, Hebei University of Technology, northwest Rubber Institute, each batch on employee training, improve the staff technical level and cultural structure, creating a number of business elites. It lays a solid foundation for the healthy development of the company.
Copper powder filled PTFE wear-resistant ring. By adding 'copper' molybdenum disulfide, and other materials, make the product has excellent wear 'creep properties. Makes the material density reached 3.5 3.8, the wear resistance of this material is a hundred times more than that of the pure PTFE.
The life is longer than the silicon rubber seal. Adapt to the temperature range of -180 ~ 250°C ,
the sealing pressure can be up to 30MPA.
custom is available
According to the actual environment of the customer needs to produce a variety of physical properties and specifications of the wear ring.
Corrosion resistance: the ability to bear in addition to the molten alkali metals, fluoride medium and more than 300 DEG C sodium hydroxide outside all acid (aqua regia), strong oxidizing agent, reducing agent and organic solvent.
Insulation: not affected by the environment and frequency, the volume resistance of up to 1018 ohm cm, dielectric loss of small, high breakdown voltage.
High and low temperature resistance: on the influence of the temperature change is not big, wide temperature range, can use the temperature of -190~260 DEG C. Self lubrication: with the smallest coefficient of friction in the plastic, is an ideal non oil lubricating material. The surface is not sticky: solid materials are known to be unable to adhere to the surface, is a surface can be the smallest solid material.
Atmospheric aging resistance, radiation resistance and low permeability: the long-term exposure to the atmosphere, the surface and the performance remains unchanged.